RoHS and REACH compliant lead-free solder paste. Low voiding, high fill, superior wetting, J-STD 004B ROL1 and ROL0 formulations. Excellent print characteristics utilizing type 4 (20-38 µm) and type 5 (15-25 µm) powder. Printer and operator friendly offering >3 days open time and tackiness time. Supplied in all lead free SAC alloys and bismuth alloys. 12 months storage, long life.